Jacob Fleck, an electrical engineer with multidisciplinary design leader TSP, Inc., has relocated to the firm’s office in Rochester.
Before transferring to Rochester, Fleck worked in TSP’s office in Rapid City, SD. He joined TSP in 2019, and he has worked on a variety of projects across the firm’s Upper Midwest footprint.
Fleck earned a bachelor’s degree in electrical engineering from the South Dakota School of Mines & Technology in 2019. He is a licensed engineer in Minnesota and South Dakota.
The addition of professional engineering services in the Rochester office is among the firm’s 2024 goals.
“While TSP has been a multidisciplinary firm for decades, having Jacob’s expertise in our Rochester office is a tremendous asset,” said Von Petersen, TSP Principal and Rochester Office Leader.
“His presence enhances our collaborative environment and strengthens our capability to deliver high-quality solutions for our clients.”
In addition to Rochester and Rapid City, TSP also has offices in Sioux Falls, SD and Watertown, SD.